E like me ka Alumina ceramic wafer polishing a me ka sapphire lapping disks i hoʻohana ʻia i ka semi-conductive, diamond polishing etc.
Kaʻina hana: ʻO nā ʻano hana a pau o ka Polishing a me ka lapping, e like me CMP chemical mechanical polishing, Mechanical Polishing, Precision Polishing.
ʻO ka maʻemaʻe kiʻekiʻe a me ka lōʻihi o ke kemika
Kiekie Mechanical ikaika a paakiki
Kū'ē Kū'ē kiʻekiʻe
Pale Voltage Kiʻekiʻe
Kūleʻa ka wela kiʻekiʻe a hiki i 1700ºC
Hana Kū'ē Kū'ē Loa
Hana Hoʻomākaʻikaʻi maikaʻi
ʻO nā ʻano āpau āpau 180,360, 450, 600mm etc
| Inoa mea kūʻai | 99.7 kiʻekiʻe maʻemaʻe Alumina ceramic Polishing Lapping Discs |
| Mea waiwai | 99.7% alumina |
| Nui maʻamau | D180, 360, 450, 600mm, ʻae ʻia ka nui maʻamau. |
| kalakala | ʻelepani |
| Palapala noi | ʻO Wafer a me Sapphire CMP kaʻina hana i ka ʻoihana semi-conductive |
| Min.Kauoha | 1Pic |
| Unite | 99.7 Alumina Seramika | ||
| Na Waiwai Nui | Al2O3 maʻiʻo | wt% | 99.7-99.9 |
| ʻO ka mānoanoa | gm/cc | 3.94-3.97 | |
| kalakala | - | ʻelepani | |
| Ka hoʻoheheʻe wai | % | 0 | |
| Na Waiwai Mechanical | ʻO ka ikaika hoʻololi (MOR) 20 ºC | Mpa(psix10^3) | 440-550 |
| Modulus Elastic 20ºC | GPa (psix10^6) | 375 | |
| ʻO Vickers Paʻakikī | Gpa(kg/mm2) R45N | >=17 | |
| Kulou ikaika | Gpa | 390 | |
| Ikaika U'i 25ºC | MPa(psix10^3) | 248 | |
| 'O'ole'a Ha'i (KI c) | Mpa* m^1/2 | 4-5 | |
| Na Waiwai wela | ʻO ka hoʻoili wela (20ºC) | W/mk | 30 |
| Coefficient o ka hoonui wela (25-1000ºC) | 1x 10^-6/ºC | 7.6 | |
| ʻO ke kū ʻana i ka haʻalulu wela | ºC | 200 | |
| Ka wela hoʻohana kiʻekiʻe | ºC | 1700 | |
| Pono Uila | Ka ikaika dielectric (1MHz) | ac-kv/mm(ac v/mil) | 8.7 |
| Dielectric mau (1 MHz) | 25ºC | 9.7 | |
| Kū'ē Volume | ohm-cm (25ºC) | >10^14 | |
| ohm-cm (500ºC) | 2×10^12 | ||
| ohm-cm (1000ºC) | 2×10^7 |
ʻAe mākou i nā kauoha maʻamau.
Inā makemake ʻoe e ʻike hou aku i ka ʻike huahana, e ʻoluʻolu e kelepona mai iā mākou a hāʻawi mākou iā ʻoe i ka huahana kūpono a me ka lawelawe maikaʻi loa!